Loading...
Derniers dépôts
-
Martina Zanetti, Alexandre Danescu, Jean-Louis Leclercq, Philippe Regregny, Maxime Darnon, et al.. Low-temperature joining of semiconductor substrates and thin layers on solid and flexible wafers by solid-liquid inter-diffusion bonding using a low-thickness Ni-Sn system. DTIP Malta 2023, May 2023, La Valletta, Malta. ⟨10.1109/DTIP58682.2023.10267939⟩. ⟨hal-04566973⟩